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BGA, PQFN and CSP Rework |
This course clearly explains all the necessary information your personnel need to understand in order to successfully rework devices such as BGAs, CSPs and PQFNs which have hidden solder connections underneath the devices.
Course Objective:
Essential
areas of this expanding technology are addressed, through
a combination of lectures and practical hands-on workshops.
At the end of the course, participants will possess a broad
understanding and the practical capability to deal with all
aspects of the rework process, including
use of rework equipment, associated materials, and inspection techniques and parameters.
Course Topics:
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Introduction
to
BGA/CSP/PQFN
technology |
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Handling & materials control |
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Inspection techniques/Defect analysis |
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Temperature profiling |
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Rework equipment parameters |
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Rework consumables |
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Removal process |
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Site preparation |
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Paste printing |
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Placement |
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Reflow |
Course
Duration:
One day.
Suitable
For:
Advanced rework operators
Booking
Form Quotation
Request Form
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