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Essentials of Surface Mount Technology |
Assembly
of circuit boards containing surface mount components can
involve a complex series of processes, which must be fully
understood by all those involved, if quality assemblies are
to be produced.
Course Objective:
This
course covers in detail the theory and applications of SMT
assembly. At the end of the course, delegates will be able
to identify the critical parameters in the manufacture of
reliable and high quality surface mounted assemblies to recognised
standards. This will be achieved using lecture sessions and
also with the option of assembling a functional surface mount assembly.
Course Topics:
Lecture sessions will cover
the following topics:
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SMT
basics - components and PCBs |
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SMT
production processes |
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Screen printing
• Process variables
• Stencils
• Solder paste issues including storage and use
• Inspection of screen printed board |
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Placement
• Loading of machines
• Common issues |
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Reflow
• Solder paste considerations (Classification JSTD-005)
• Thermal profiles (Preheat, Ramp, Rates, Peak Temperature)
(Classification JSTD-005) |
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SMT
defects and their causes |
Optional modules:
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RoHS leglislation overview |
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Component considerations for assembly processes |
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Advanced quality awareness |
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Optimising PCB cleanliness |
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Intrusive reflow process |
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Materials analysis techniques |
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Use of adhesives |
Practical
hands-on session will demonstrate the best practices in:
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Thermal profiling of soldering equipment |
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Assembly of SMT circuit board |
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Inspection |
Course
Duration:
Two days (optional modules and practical workshop available)
Suitable
For:
Operators, Technicians and Supervisors.
Booking
Form Quotation
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